ASUS ROG Strix X870E-E Gaming WiFi, AMD ATX motherboard, 18+2+2 power stages

ASUS ROG Strix X870E-E Gaming WiFi

ASUS ROG Strix X870E-E Gaming WiFi, AMD ATX motherboard, 18+2+2 power stages, DDR5 slots, five M.2 slots, PCIe 5.0 with full support for next-gen GPUs, WiFi 7, USB 20G w/PD 3.0 up to 30W

  • Ready for Advanced AI PCs: Designed for the future of AI computing, with the power and connectivity needed for demanding AI applications
  • AMD AM5 Socket: Ready for AMD Ryzen 9000, 8000 and 7000 series desktop processors
  • Intelligent Control: ASUS-exclusive AI Overclocking, AI Cooling II, AI Networking II and AEMP to simplify setup and improve performance
  • ROG Strix Overclocking technologies: Dynamic OC Switcher, Core Flex, Asynchronous Clock and PBO Enhancement
  • Robust Power Solution: 18+2+2 power solution rated for 110A per stage with dual ProCool II power connectors, high-quality alloy chokes and durable capacitors to support multi-core processors
  • Optimized Thermal Design: Massive heatsinks with integrated I/O cover, high-conductivity thermal pads, and connected with an L-shaped heatpipe
  • Latest M.2 Support: Three onboard PCIe 5.0 M.2 slots, and two PCIe 4.0 M.2 slots, all with substantial cooling solutions
  • Abundant Connectivity: Dual USB4 Type-C ports, USB 20Gbps Type-C rear I/O port with PD 3.0 up to 30W and USB Wattage Watcher, ten additional USB 10Gbps ports, PCIe 5.0 x16 SafeSlot with full support for next-gen graphics cards, HDMI port
  • High-Performance Networking: On-board WiFi 7 (802.11be) with Realtek 5 Gb Ethernet
SKU: B0DGQ7NHT2
Weight: 2 kg
Dimensions: 30.5 x 24.4 x 1 cm; 2 kg
Brand: ASUS
Model: 90MB1IB0-M0EAY0
Manufacture: ASUS

From the manufacturer

 ROG

COOLING

  1. VRM HEATSINK ARRAY: Two thick VRM heatsinks are connected by a heatpipe, sharing cooling capacity across VRMs and providing ample surface area and mass to handle the power needs of high-performance AMD Ryzen 9000 Series processors.
  2. M.2 COMBO-SINK: This M.2 heatsink integrates a direct-contact U-shaped heat pipe to achieve optimal operating temperatures, and it has been upgraded with a larger surface area for even more cooling.
  3. M.2 BACKPLATE: An integrated backplate helps ensure that high-performance drives can deliver peak performance, even when airflow is restricted.
  4. M.2 HEATSINKS: Heatsinks cover every slot to help keep onboard NVME SSDs at optimal temperatures for consistent performance and reliability.